|
|
Features |
Capability |
| Layers |
1-10 layers |
| Material |
FR4 |
| Copper Thickness |
1/2 to 2oz (18um-70um) |
|
Board Thickness |
.016-.126" (0.4mm-3.2mm) |
| Surface finish |
HASL,Ni/Au,OSP |
| Soldermask |
LPI, different colors |
| Board Dimension |
600x700mm |
| Min Hole Diameter |
8mil (0.2mm) |
| Min line width |
8mil (0.2mm) |
| Min line spacing |
8mil (0.2mm) |
| Min SMT pitch |
16mil (0.4mm) |
| Min. Annular Ring |
.008" (0.2mm) |
| Aspect Ratio |
5:1 |
| Surface/hole plating |
ave. 25um min. 20um |
| Hole Tolerance (PTH) |
.002" (0.05mm) |
| Hole Tolerance (NPTH) |
.003" (0.075mm) |
| SM Tolerance (LPI) |
.003" (0.075mm) |
| Dimension |
.004" (0.1mm) |
| Electrically test |
10V-250V, flying probe or testing fixture |
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