Incomming Quality Control (I.Q.C)

"The quality of the final product directly depends upon the quality of the components that go into it "

So it very essential that all parts are completely inspected before use in the assembly. IQC (Incoming Quality Control) is the inspection and verification of all raw material received prior to the assembly process. Components are procured only from the specifically approved vendor list. This gives us an assured supply and accountability in our supply chain. To our customers, it delivers good quality.

Incoming inspection is done for all components. Acceptable Quality Limits are established and inspection done accordingly. Tronixlink's insistence on a high IQC helps ensures defect free products and save costs for our customers.

Semiconductors IQC covers:

• Correctness of part numbers
• SMT components are inspected for proper reel packing and solder band quality.
• Inspection of sealing and manufacturer's identification marks (Manufacturer seals the device packet in Inert atmosphere).
• Date of manufacture is checked thoroughly. Components older than 6 months are not accepted.

Mechanical IQC covers:

1. Dimensions , Finish of plating / painting
2. Quality of printing in case of parts with printing on it
3. Color specifications

Assembly Control

The back-end assembly operation has 9 stations dedicated for inspection. Manual soldering, Mechanical Assembly Inspection, Subassembly Inspection, Critical parameter measurement, Functional testing, RF calibration check, Throughput measurement, Association tests are some of the inspections done here. The yield in the back-end assembly is steadily increasing towards 95%.

SMT Placement and Soldering Process

Tronixlink's products use mostly surface mount components for high reliability. A comprehensive list of checks, such as

• SMT line component correctness checks
• Component placement
• Accuracy checks
• Soldering temperature profile
• Solder paste coverage in pad area
• Solder paste height

are conducted. Thus, the parameters are critically monitored and controlled. The PCB goes through X-Ray inspection for solder quality. The SMT process first pass yield is closely monitored to be higher than 95%.

We believe that the decision to test begins before an assembly is produced. We have a dedicated staff to assist you in the design for testability and manufacturability. When full- blown test fixtures may be cost and time prohibitive, we offer flying probe testing. Additionally we offer full functional testing using customer provided and/or in-house test fixtures. We have extensive experience in RF Testing and Tuning Systems. Our customers utilize our environmental test chambers and burn-in racks so they can validate and monitor product quality and reliability. Additionally, our environmental chamber can monitor single or cascading temperatures down to -100 degrees C. We measure and report true first pass yield for continuous improvement.