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The MiniBoardPro
MiniBoardPro boards are two layer boards with all holes plated through. They include the solder mask layers giving the boards a green color and a very professional look. Printed on the top surface is a white silkscreen layer showing the component outlines and text.
Manufacturing Specs: MiniBoardPro
Boards are manufactured double-sided with all holes plated-through.
Single-sided boards are manufactured with plated-through holes.
The laminate is 0.062" FR-4 epoxy glass with 1/2 ounce copper. We plate an additional 3/4 ounce of copper (totaling 1 1/4 ounce), resulting in a copper thickness of ~0.0017".
The top and bottom solder mask layers are green LPI.
Pads on the solder mask layers are grown by a minimum of 0.003" on all sides. As a result, very fine pitch surface mount components may not include any solder mask between the pins.
A white silkscreen is printed on the top side of the board showing component outlines and text. These features are automatically masked to prevent the white printing from overlapping on top of pads (or anywhere there is no solder mask).
The board finish is the industry standard SMOBC with pads having a tin/lead solder plating.
Twenty-three hole sizes are available: 0.014", 0.020", 0.025", 0.029", 0.033", 0.035", 0.040", 0.043", 0.046", 0.052", 0.061", 0.067", 0.079", 0.088", 0.093", 0.100", 0.110", 0.125", 0.141", 0.150", 0.167", 0.192", 0.251". These sizes are the finished hole diameters after plating. The 0.014" hole may be filled with solder and can only be used as via. The tolerance for the 0.020" hole is +0.003 / -0.005. The tolerance for the other hole sizes are +/- 0.004". Hole sizes other than those list are not offered.
- The dielectric constant of our FR-4 laminate ranges from 4.2 to 5.0.
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The Standard MiniBoard
Standard MiniBoards are two layer boards with plated through holes. They do not include the solder mask or silkscreen layers which are primarily cosmetic. Electrically, these boards are first rate with bright shiny traces and pads. Because they do not have green solder masks, they are the yellowish color of the industry standard FR-4 laminate.
Manufacturing Specs: Standard MiniBoard
Boards are manufactured double-sided with all holes plated-through.
Single-sided boards are manufactured with plated-through holes.
The laminate is 0.062" FR-4 epoxy glass with 1/2 ounce copper. We plate an additional 3/4 ounce of copper (totaling 1 1/4 ounce), resulting in a copper thickness of ~0.0017".
The final finish is tin-lead reflow.
Twenty-three hole sizes are available: 0.014", 0.020", 0.025", 0.029", 0.033", 0.035", 0.040", 0.043", 0.046", 0.052", 0.061", 0.067", 0.079", 0.088", 0.093", 0.100", 0.110", 0.125", 0.141", 0.150", 0.167", 0.192", 0.251". These sizes are the finished hole diameters after plating. The 0.014" hole may be filled with solder and can only be used as via. The tolerance for the 0.020" hole is +0.003 / -0.005. The tolerance for the other hole sizes are +/- 0.004". Hole sizes other than those list are not offered.
- The dielectric constant of our FR-4 laminate ranges from 4.2 to 5.0.
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The 4 Layer - MiniBoardPro
4 Layer - MiniBoardPro boards have top and bottom copper layers. Two more layers are sandwiched inside forming Ground and Power planes. Through-hole pads can be connected to, or isolated from, the inner planes. These boards include the green solder mask and white silkscreen layers for a very professional appearance.
Manufacturing Specs: 4 Layer - MiniBoardPro
Boards are manufactured with 4 copper layers and plated-through holes.
The laminate is FR-4 with an overall thickness of 0.058". The two inner layers have a copper weight of 1 ounce. The outer copper layers have a finished copper weight of ~1.25 ounce.
The top and bottom solder mask layers are green LPI.
Pads on the solder mask layers are grown by 0.003" on all sides. As a result, very fine pitch surface mount components may not include any solder mask between the pins.
A white silkscreen is printed on the top side of the board showing component outlines and text. These features are automatically masked to prevent the white printing from overlapping on top of pads (or anywhere there is no solder mask).
The board finish is the industry standard SMOBC with pads having a tin/lead solder plating.
Twenty-four hole sizes are available: 0.008", 0.014", 0.020", 0.025", 0.029", 0.033", 0.035", 0.040", 0.043", 0.046", 0.052", 0.061", 0.067", 0.079", 0.088", 0.093", 0.100", 0.110", 0.125", 0.141", 0.150", 0.167", 0.192", 0.251". These sizes are the finished hole diameters after plating. The 0.008" and 0.014" holes may be filled with solder and can only be used as via. The tolerance for the 0.020" hole is +0.003 / -0.005. The tolerance for the other hole sizes are +/- 0.004". Hole sizes other than those list are not offered.
The dielectric spacing between the top layer and the "Ground" inner layer is 0.012" with a dielectric constant of 4.6 +/-0.2. The dielectric spacing between the bottom layer and the "Power" inner layer is 0.012" with a dielectric constant of 4.6 +/-0.2. The dielectric spacing between the "Power" and "Ground" inner layers is 0.028" with a dielectric constant of 4.6 +/-0.2.
The two inner layers are solid copper planes. Through-hole pads can either be connected to or isolated from these copper planes. The planes are inset 0.025" from each edge of the board.
- We do not recommend that users cut apart 4 layer boards because this can result in shorts between the inner layers.
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