|
MultilayerLamination
-Up to 20 Layers
-Sequential lamination
-Automated registration |
Drilling
-.006" Mechanical |
Etching
-Trace/Space 2/2 mils |
Plating
-Aspect ratio 10+ |
|
Solder mask
-LPI, Dry Film |
Silkscreen
-Automated
-5 mil lines |
Fabrication
-Route and retain
-Scoring |
Drill
-Laser Drill down to 2 mils (.002") |
|
Quality and Production Control Information System
-Pro-CIM |
Electrical Test
-.5mm pitch, Flying probe and High Density grid |
Materials
-Lead Free FR-4
-Polyimide
-Rogers 4003 & 4350
-Teflon
-Ceramics
-Most other materials |
